High temperature high voltage potting adhesive

Abstract This study presents the results of a new resin survey for potting high voltage electronics. The main objective consists in improving European manufacturing capability (>6 kV) and temperature applications (maximum temperature: 180°C). targeted improvements include enhanced thermal stability insulation properties adhesive target lifetime 15 years. In addition, specific attention has been given to EU sourced materials development. Class H resins were targeted. A trade-off based on technical data sheets, tests at material, sample breadboard levels conducted. complete test sequence performed lead identify suitable requirements processes. TRL4 reached, but there is still long way go use it space product. next steps are implementation this current equipment qualification magnetics parts impregnated or moulded with resin.